F68 PIE Engineer

Job description

Job Description

In this position, you will be working as a member of Intel F68 Yield/Integration team, helping to develop new state-of-the-art Intel NVM technologies - focusing on yield improvement and enhancement. The work will involve activities such as planning of yield related activities, building yield roadmap by segmenting and resolving yield limiters, developing physical or device physics based models, estimating failure rates, and managing risks by actively driving process development and optimization, in order to enable aggressively ramping of Intel's NVM technologies and exploration of novel memory cells. You will be expected to work with/lead small cross-functional groups of engineers on technical projects. Your responsibilities will include but not be limited to:

- Participating in technology development, transfer, and ramp activities to meet yield, reliability, cost, and device performance goals

- Driving and prioritizing integrated experiments to troubleshoot and optimize process flows

- Owning particular sections of process flow, and responsible for its optimization, cost reduction, and performance improvement goals

- Maintaining and driving process qualification matrix and deliverables

- Rapid response to process excursions and drive to quick integrated solutions

- Working with Process Engineering to improve process stability and capability as well as reduce defects

- Exercising good judgment, sometimes with insufficient data, to determine appropriate action and mitigate integrated risks.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Desired profile

Qualifications

Must possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering. Additional qualifications include:
- Strong understanding of structural and process integration
- Proven ability to troubleshoot and solve device related issues
- Proven ability to troubleshoot and optimize process flows
- Advanced data extraction, analysis, and reporting skills
- Advanced understanding of device physics and NAND FLASH operation and structure
- Intermediate understanding of SPC principles
- Advanced PC skills including Microsoft Office
- Proven ability to troubleshoot complex problems and address root causes
- Demonstrated analytical problem solving skills
- Basic knowledge of probe, backend and reliability
- Proven ability to work effectively with minimal supervision
- Proven ability in multi-tasking complex projects
- Proven ability to communicate and present technical material effectively
- Demonstrated strong partnering and team building skills
- Proven time management, organization, and prioritization skills